Seagate is looking for a Wafer-Level Thin Film Transfer Intern to be located in our Bloomington, MN facility.
Intern will be responsible for helping identify, create, and validate layer transfer solutions in recording head fabrication. The primary goal is to transfer a thin film layer processed on a carrier wafer to a target wafer with sufficient bonding strength to survive subsequent wafer processing. Individual will participate in assessing options in materials selection, wafer surface preparation and layer transfer technique, then work with engineering staff to implement and validate the best option(s) in prototype recording heads. Individual will also work closely with metrology engineers in assessing, selecting and implementing characterization techniques to validate the bonding quality at the interface between the transferred layer and the target wafer. Key activities include development of film deposition, wafer surface preparation, layer transfer, and carrier wafer removal processes and bonding quality characterization metrology. Individual will work with a team of PhD engineers in lab and clean room environments using different experimental techniques including physical vapor deposition, ion milling, photo-lithography patterning, adhesion, and SEM/TEM characterization, etc.
Job Family: Engineering Professional
Seagate Technology is committed to equal opportunity in employment and welcomes applications from all sections of the community, irrespective of sex, marital status, religious affiliation, age, disability, veteran status, or ethnic origin